Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel

Pentium

4 Processor in the 478-Pin Package Thermal Design Guidelines

Design Guide 41

3.1.3.5 Recommended BIOS/CPU/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with

the thermal mechanical enabling components assembled. The test shall be conducted on a fully

operational motherboard that has not been exposed to any battery of tests prior to the test being

considered.

Testing setup should include the following components, properly assembled and/or connected:

• Appropriate system motherboard

• Processor

• All enabling components, including socket and thermal solution parts

• Power supply

• Disk drive

• Video card

• DIMM

• Keyboard

• Monitor

The pass criterion is that the system under test shall successfully complete the checking of BIOS,

basic processor functions and memory, without any errors. Intel PC Diags is an example of

software that can be utilized for this test.

3.1.4 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose

materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic

materials such as PVC formulations, certain polyurethane compositions (e.g., polyester and some

polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes

also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-

810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel

recycling standards.