Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines

Intel
®
Pentium
®
4 Processor in the 478-Pin Package Thermal Design Guidelines
R
Design Guide 5
Figures
Figure 1. Processor IHS Temperature Measurement Location.........................................13
Figure 2. Processor Thermal Resistance Relationships ...................................................16
Figure 3. Guideline Locations for Measuring Local Ambient Temperature (not to scale) .20
Figure 4. Desired Thermocouple Location ........................................................................22
Figure 5. Location of Kapton* Tape for Temporary Bond..................................................22
Figure 6. Thermocouple Bead Covered with Epoxy..........................................................23
Figure 7. Grooved Heatsink Bottom ..................................................................................24
Figure 8. Heatsink Bottom Groove Dimensions ................................................................24
Figure 9. Radial Heatsink Geometry .................................................................................25
Figure 10. Electrical Connection for Heater.......................................................................28
Figure 11. Thermal Sensor Circuit.....................................................................................31
Figure 12. Concept for Clocks under Thermal Monitor Control.........................................32
Figure 13. Thermal Diode Sensor Time Delay ..................................................................35
Figure 14. Random Vibration PSD ....................................................................................39
Figure 15. Shock Acceleration Curve................................................................................40
Figure 16. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components – 1.........................................................................................................44
Figure 17. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components – 2.........................................................................................................45
Figure 18. Volumetric Keep-in for Enabling Components .................................................46
Figure 19. Exploded View of the Thermal Mechanical Enabling Assembly for the
Processor ...................................................................................................................47
Figure 20. Heatsink, Fan, and Shroud Assembly Volumetric Keep-in...............................49
Figure 21. Clip Bearing Surface. Critical X-Y Dimensions and Position............................49
Figure 22. Retention Mechanism – 1.................................................................................56
Figure 23. Retention Mechanism – 2.................................................................................57
Figure 24. Clip Frame........................................................................................................58
Figure 25. Clip Lever .........................................................................................................59
Figure 26. Clip Assembly...................................................................................................60
Tables
Table 1. Recommended DC Power Supply Ratings..........................................................27
Table 2. TTV Correction Factors .......................................................................................29
Table 3. Reference Heatsink Performance Target............................................................37
Table 4. Fan Performance Recommendation ...................................................................38