Intel Pentium 4 Processor in the 478-PinPackage at 1.40 GHz, 1.50 GHz, 1.60 GHz, 1.70 GHz, 1.80 GHz, 1.90 GHz, and 2GHz

4 Datasheet
6.0 Thermal Specifications and Design Considerations................................. 77
6.1 Thermal Specifications........................................................................................ 79
6.2 Thermal Analysis................................................................................................. 79
6.2.1 Thermal Solution Performance............................................................... 79
6.2.2 Measurements For Thermal Specifications............................................ 80
7.0 Features ....................................................................................................................... 81
7.1 Power-On Configuration Options ........................................................................ 81
7.2 Clock Control and Low Power States.................................................................. 81
7.2.1 Normal State—State 1 ........................................................................... 81
7.2.2 AutoHALT Powerdown State—State 2 .................................................. 81
7.2.3 Stop-Grant State—State 3 ..................................................................... 82
7.2.4 HALT/Grant Snoop State—State 4 ........................................................ 83
7.2.5 Sleep State—State 5.............................................................................. 83
7.2.6 Deep Sleep State—State 6 .................................................................... 84
7.3 Thermal Monitor .................................................................................................. 84
7.3.1 Thermal Diode........................................................................................ 86
8.0 Boxed Processor Specifications ....................................................................... 87
8.1 Introduction ......................................................................................................... 87
8.2 Mechanical Specifications................................................................................... 88
8.2.1 Boxed Processor Cooling Solution Dimensions..................................... 88
8.2.2 Boxed Processor Fan Heatsink Weight.................................................. 89
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly................................................................................................ 89
8.3 Electrical Requirements ...................................................................................... 90
8.3.1 Fan Heatsink Power Supply................................................................... 90
8.4 Thermal Specifications........................................................................................ 91
8.4.1 Boxed Processor Cooling Requirements ............................................... 92
8.4.2 Variable Speed Fan ............................................................................... 93
9.0 Debug Tools Specifications................................................................................. 95
9.1 Logic Analyzer Interface (LAI)............................................................................. 95
9.1.1 Mechanical Considerations .................................................................... 95
9.1.2 Electrical Considerations........................................................................ 95