Intel Pentium 4 Processor in the 478-PinPackage at 1.40 GHz, 1.50 GHz, 1.60 GHz, 1.70 GHz, 1.80 GHz, 1.90 GHz, and 2GHz

Package Mechanical Specifications

Datasheet 47

4.0 Package Mechanical Specifications

The Pentium 4 processor in the 478-pin package is packaged in a Flip-Chip Pin Grid Array

(FC-PGA2) package. Components of the package include an integrated heat spreader

(IHS), processor core, and the substrate which is the pin carrier. Mechanical specifications

for the processor are given in this section. See Section 1.1 for a terminology listing. The

processor socket which accepts the Pentium 4 processor in the 478-pin package is

referred to as a 478-Pin micro PGA (mPGA478B) socket. See the Intel® Pentium® 4

Processor 478-Pin Socket (mPGA478B) Design Guidelines for complete details on the

mPGA478B socket.

Note: For Figure 22 through Figure 28 the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. All dimensions are not tested, but guaranteed by design characterization.

3. Figures and drawings labeled as “Reference Dimensions” are provided for

informational purposes only. Reference dimensions are extracted from the

mechanical design database and are nominal dimensions with no tolerance

information applied. Reference dimensions are not checked as part of the processor

manufacturing process. Unless noted as such, dimensions in parentheses without

tolerances are reference dimensions.

4. Drawings are not to scale.

Note: The drawing below is not to scale and is for reference only. The socket and system board

are supplied as a reference only.

Figure 22. Exploded View of Processor Components on a System Board

stem board

mPGA478B

31 mm

Heat Spreader

Substrate

35mm square

3.5mm

2.0mm

478 pins

Socket