Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Introduction
R
Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide 11
1.2 References
Material and concepts available in the following documents may be beneficial when reading this
document.
Document
1
Location
Intel
®
Pentium
®
4 Processor on 90 nm Process Datasheet http://developer.intel.com/desig
n/pentium4/datashts/300561.ht
m
Intel
®
865G/865GV/865PE/865P Chipset Design Guide http://developer.intel.com/desig
n/chipsets/designex/252518.ht
m
Intel
®
865G/865GV Chipset: Intel
®
82865G/82865GV Graphics and
Memory Controller Hub (GMCH) Datasheet
http://www.intel.com/design/chi
psets/datashts/252514.htm
Intel
®
Pentium
®
4 Processor with 512 KB L2 Cache on 0.13 Micron
Process Thermal Design Guidelines
http://developer.intel.com/desig
n/pentium4/guides/252161.htm
Intel
®
Pentium
®
4 Processor 478-Pin Socket (mPGA478B) Design
Guidelines
http://developer.intel.com/desig
n/pentium4/guides/249890.htm
Mechanical Enabling for the Intel
®
Pentium
®
4 Processor in the 478-Pin
Package
http://developer.intel.com/desig
n/pentium4/guides/290728.htm
Performance ATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Performance microATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
NOTES:
1. Contact your Intel field sales representative for information on additional documentation.
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the topside of
the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
C
– T
A
) / Total Package Power. Heat
source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
C
– T
S
) / Total Package Power.