Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines
Introduction
R
12 Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide
Term Description
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
Θ
CA
Case-to-ambient thermal resistance (theta). Defined as (T
C
– T
A
) / Power dissipated from
case to ambient.
Θ
CS
Case-to-sink thermal resistance. Defined as (T
C
– T
S
) / Power dissipated from case to sink.
Θ
SA
Sink-to-ambient thermal resistance. Defined as (T
S
– T
A
) / Power dissipated from sink to
ambient.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor case. This material fills the air gaps and voids, and enhances the transfer of
the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: a thermally conductive lid integrated into a processor package to
improve heat transfer to a thermal solution through heat spreading.
mPGA478
The surface mount Zero Insertion Force (ZIF) socket designed to accept the Intel
®
Pentium
®
4 processor on 90 nm process.
ACPI
Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
Thermal
Monitor
A feature on the Pentium 4 processor on 90 nm process that can keep the processor’s die
temperature within factory specifications under nearly all conditions.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature is very near its operating
limits.
TTV
The Thermal Test Vehicle is a thermal test tool that is used in component heatsink design.
The availability of of this tool is limited. Contact your local field sales representative for
more information.