Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Thermal Requirements

Intel

Pentium

4 on 90 nm Process Thermal Design Guide 15

3 Thermal Requirements

3.1 Processor Case Temperature and Power

Dissipation

Refer to the Intel

Pentium

4 Processor on 90 nm Process Datasheet for processor thermal

specifications.

Thermal specifications for the Pentium 4 processor on 90 nm process is the thermal profile. The

thermal profile defines maximum case temperature as a function of power dissipated. The

maximum case temperature for the maximum thermal design power (TDP) is the end point of the

thermal profile. The thermal profile accounts for processor frequencies and manufacturing

variations. Designing to these specifications allows optimization of thermal designs for processor

performance (refer to Section 3.4).

The majority of processor power is dissipated up through the Integrated Heat Spreader (IHS).

There are no additional components (i.e., BSRAMs) that generate heat on this package. The

amount of power that can be dissipated as heat through the processor package substrate and into

the socket is usually minimal.

The case temperature is defined as the temperature measured at the geometric center of the top

surface of the IHS. This point also corresponds to the geometric center of the package for the

Pentium 4 processor on 90 nm process. For illustration, the measurement location for a

35 mm x 35 mm [1.378 in x 1.378 in] FC-mPGA4 package with 31 mm x 31 mm

[1.22 in x 1.22 in] IHS is shown in Figure 1. Techniques for measuring the case temperature are

detailed in Section 3.3.3. In case of conflict, the package dimensions in the processor datasheet

supercede dimensions provided in this document.

Figure 1. Processor Case Temperature Measurement Location