Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

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4 Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide
3.6 Acoustic Fan Speed Control................................................................................. 32
3.6.1 Example Implementation ...................................................................... 33
3.6.2 Graphs of Fan Response...................................................................... 33
3.7 Reading the On-Die Thermal Diode Interface...................................................... 34
3.8 Impacts to Accuracy ............................................................................................. 35
4 Intel
®
Thermal/Mechanical Reference Design Information............................................... 37
4.1 Intel
®
Validation Criteria for the Reference Design .............................................. 37
4.1.1 Thermal Performance ........................................................................... 37
4.1.1.1 Reference Heatsink Performance Target............................ 37
4.1.1.2 Acoustics ............................................................................. 38
4.1.1.3 Altitude................................................................................. 38
4.1.1.4 Reference Heatsink Thermal Validation.............................. 38
4.1.2 Fan Performance for Active Heatsink Thermal Solution ...................... 39
4.1.3 Environmental Reliability Testing.......................................................... 39
4.1.3.1 Structural Reliability Testing................................................ 39
4.1.3.1.1 Random Vibration Test Procedure ...................... 39
4.1.3.1.2 Shock Test Procedure......................................... 40
4.1.3.1.3 Recommended Test Sequence........................... 41
4.1.3.1.4 Post-Test Pass Criteria ....................................... 41
4.1.3.2 Long-Term Reliability Testing.............................................. 41
4.1.3.2.1 Temperature Cycling ........................................... 41
4.1.3.3 Recommended BIOS/CPU/Memory Test Procedures ........ 42
4.1.4 Material and Recycling Requirements.................................................. 42
4.1.5 Safety Requirements ............................................................................ 43
4.1.6 Geometric Envelope for Intel Reference Thermal Mechanical Design 43
4.2 Reference Thermal Solution for the Intel
®
Pentium
®
4 Processor on 90 nm
Process................................................................................................................. 44
4.2.1 Reference Components Overview........................................................ 44
4.2.2 Reference Mechanical Components .................................................... 46
4.2.2.1 Heatsink Attach Clip ............................................................ 46
4.2.2.2 Retention Mechanism.......................................................... 46
4.2.2.3 Heatsink............................................................................... 46
4.2.2.4 Thermal Interface Material .................................................. 46
4.2.2.5 Fan and Hub Assembly ....................................................... 46
4.2.2.6 Fan Attach ........................................................................... 46
4.2.2.7 Fan Guard ........................................................................... 47
4.3 Evaluated Third-Party Thermal Solutions ............................................................ 47
Appendix A: Thermal Interface Management........................................................................................... 49
Appendix B: Intel Enabled Reference Thermal Solution .......................................................................... 51
Appendix C: Mechanical Drawings........................................................................................................... 53
Appendix D: T
CASE
Reference Metrology.................................................................................................. 67
Thermal Test Vehicle (TTV) Preparation .......................................................................... 67
Thermocouple Attach Procedure ...................................................................................... 69
Thermocouple Preparation .................................................................................. 69
Thermocouple Positioning ................................................................................... 70
Epoxy Application................................................................................................. 72
Appendix E: TTV Metrology...................................................................................................................... 75