Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines
Intel® Thermal/Mechanical Reference Design Information
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Intel
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Pentium
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4 on 90 nm Process Thermal Design Guide 41
4.1.3.1.3 Recommended Test Sequence
Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that
have never been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/CPU/Memory test (refer to Section 4.1.3.3). The stress test should be then followed by a
visual inspection and then BIOS/CPU/Memory test.
4.1.3.1.4 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the retention mechanism windows, including any
indication of shearing, cracks in the retention mechanism body, or evidence of significant clip
lever penetration into the fan shroud, if these features exist in the design.
2. Clip must remain latched to retention mechanism windows.
3. Heatsink remains seated and its bottom remains mated flatly against IHS surface. No visible
gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect
to the retention mechanism.
4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink
attach clip.
5. No visible physical damage to the processor package.
6. Successful BIOS/processor/memory test of post-test samples.
7. Thermal compliance testing to demonstrate that the case temperature specification can be
met.
4.1.3.2 Long-Term Reliability Testing
4.1.3.2.1 Temperature Cycling
Temperature cycling is performed to test for long-term reliability. This test is conducted using the
parameters shown in Table 3.
Table 3. Temperature Cycling Parameters
Parameters Unit
Number of Cycles 1000 Cycles
Maximum Temperature 85 °C
Minimum Temperature -40 °C
Dwell Time @ Maximum and Minimum
Temperatures
15 Minutes
Minimum to Maximum Temperature Ramp Rate 15 °C/Minute
Maximum to Minimum Temperature Ramp Rate 15 °C/Minute