Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

R
6 Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide
Figures
Figure 1. Processor Case Temperature Measurement Location ..................................... 15
Figure 2. Heatsink Exhaust Providing Platform Subsystem Cooling ................................ 18
Figure 3. Processor Thermal Characterization Parameter Relationships ........................ 20
Figure 4. Locations for Measuring Local Ambient Temperature, Active Heatsink (not to
scale) ......................................................................................................................... 22
Figure 5. Locations for Measuring Local Ambient Temperature, Passive Heatsink (not to
scale) ......................................................................................................................... 23
Figure 6. Thermal Sensor Circuit ...................................................................................... 25
Figure 7. Concept for Clocks under Thermal Monitor Control .......................................... 26
Figure 8. Example Thermal Profile ................................................................................... 31
Figure 9. Example Acoustic Fan Speed Control Implementation ..................................... 33
Figure 10. Example Fan Speed Response....................................................................... 34
Figure 11. Random Vibration PSD.................................................................................... 40
Figure 12. Shock Acceleration Curve ............................................................................... 40
Figure 13. Exploded View of Reference Thermal Solution Components (with Optional
Fan Guard)................................................................................................................. 45
Figure 14. Motherboard Keep-Out Footprint Definition and Height Restrictions for
Enabling Components (Sheet 1 of 3) ........................................................................ 54
Figure 15. Motherboard Keep-out Footprint Definition and Height Restrictions for
Enabling Components (Sheet 2 of 3) ........................................................................ 55
Figure 16. Motherboard Keep-out Footprint Definition and Height Restrictions for
Enabling Components (Sheet 3 of 3) ........................................................................ 56
Figure 17. Retention Mechanism (Sheet 1 of 2) ............................................................... 57
Figure 18. Retention Mechanism (Sheet 2 of 2) ............................................................... 58
Figure 19. Heatsink Retention Clip ................................................................................... 59
Figure 20. Fan Attach........................................................................................................ 60
Figure 21. Fan Impeller Sketch......................................................................................... 61
Figure 22. Heatsink (Sheet 1 of 2) .................................................................................... 62
Figure 23. Heatsink (Sheet 2 of 2) .................................................................................... 63
Figure 24. Heatsink Assembly (Non-validated Fan Guard Shown. Sheet 1 of 2) ............ 64
Figure 25. Heatsink Assembly (Non-validated fan guard shown, Sheet 2 of 2) ............... 65
Figure 26. Integrated Heat Spreader (IHS) Thermocouple Groove Dimension ............... 68
Figure 27. Thermocouple Wire Preparation...................................................................... 69
Figure 28. TTV Cleaning Preparation ............................................................................... 70
Figure 29. TTV Thermocouple Instrumentation ................................................................ 70
Figure 30. Thermocouple Attach Preparation................................................................... 71
Figure 31. TTV Initial Glue Application ............................................................................. 72
Figure 32. TTV Final Glue Application .............................................................................. 72
Figure 33. Trimming of Excess Glue................................................................................. 73
Figure 34. Final TTV Cleaning .......................................................................................... 73
Figure 35. TTV Final Inspection........................................................................................ 74
Figure 36. Intel
®
Pentium
®
4 Processor on 90 nm Process Thermal Test Vehicle Topside
Markings .................................................................................................................... 75
Figure 37. Unpopulated Motherboard............................................................................... 76
Figure 38. Motherboard with Socket Attached.................................................................. 76
Figure 39. Power Supply Connection to Motherboard...................................................... 77
Figure 40. Electrical Connection for Heater...................................................................... 78