Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix D: TCASE Reference Metrology
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Intel
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Pentium
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4 on 90 nm Process Thermal Design Guide 67
Appendix D: T
CASE
Reference Metrology
The procedure for attaching thermocouples to the Thermal Test Vehicle (TTV) for use in thermal
experiments is described in this appendix. A repeatable and accurate thermocouple attach process
reduces overall experimental variation, cuts down on preparation time for measurements, and
most importantly yields robust temperature measurements. Elements of this metrology may
change in the future to further improve its accuracy and/or precision.
This appendix discusses the TTV preparation, attach, and cure procedure for attaching
thermocouples in a ‘flat’ or 0° orientation on the TTV integrated heat spreader (IHS). This
procedure is tailored to the use of 36 gauge thermocouples. A list of necessary items is shown in
Table 8.
Thermal Test Vehicle (TTV) Preparation
The TTV assembly process is very similar to the assembly process of the Pentium 4 processor on
90 nm process. To place a thermocouple on the surface of the integrated heat spreader (IHS), a
groove must first be machined into the surface. The thermocouple groove must be made by an
experienced machinist with precision equipment and adhere to the tolerances listed in Figure 26.
Improper or non-compliant manipulation of the IHS surface can cause damage to the TTV or
cause erroneous results during the testing procedure. After the machining process, the IHS surface
on the TTV should be thoroughly cleaned to remove any debris or residue. Isopropyl alcohol
should be used to remove any residue from handling or the machining process.