Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix D: TCASE Reference Metrology

Intel

Pentium

4 on 90 nm Process Thermal Design Guide 69

Thermocouple Attach Procedure

The following items are required for thermocouple removal or reattach.

Table 8. Thermalcouple Attach Material List

Thermalcouple Attach Material List

Scribe

Fine point tweezers

Exacto* knife (#11 blade)

Thermocouple (36 gauge, 0.9 m [36 in], Teflon insulation)

3M Kapton* tape cut into strips (3 mm x 13 mm [0.125 in x 0.5 in])

Epoxy (Omega Bond* 101)

Thermocouple Preparation

The thermocouple wire must be prepared for attach using the following procedure.

1. Hold the thermocouple (T/C) in hand, locate the beaded end and straighten the wire by hand

so that the first 100–150 mm [4-6 in] are reasonably straight.

2. Use fine point tweezers to make sure that the bead and the two wires coming out are straight

and untwisted. Make sure that the second layer of insulation, which is sometimes clear, is not

covering the bead.

3. Bend both the thermocouple wires slightly at a location approximately 3 mm [0.125 in] away

from the thermocouple bead. When this thermocouple is placed on a flat surface the bend

serves to spring load the bead and guarantee that the thermocouple bead is making contact

with the bottom of the groove when it is inserted into the channel.

Figure 27. Thermocouple Wire Preparation