Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix D: TCASE Reference Metrology
R
72 Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide
Epoxy Application
Apply the epoxy to attach the thermocouple using the following procedure.
1) Use a scribe or an Exacto* knife to apply the epoxy over the bead in the channel. If an Exacto
knife is used, a #11 blade is recommended because the blade has a sharp point and can also
act as a small trowel. Apply epoxy over the bead and on the exposed thermocouple wires.
Very little epoxy is needed to attach the thermocouple. The epoxy application should cover
the thermocouple bead and some portion of the insulated thermocouple wires. Excess epoxy
will be trimmed flush to the IHS in a later step and after the epoxy has cured. It is
recommended to minimize the amount of excess epoxy applied outside the grooved channel.
Figure 31. TTV Initial Glue Application
2) Let the epoxy cure for eight (8) hours at room temperature. Minimize any movement and/or
vibration since it will tend to cause the T/C bead to float up and create non-continuity.
C
C
A
A
U
U
T
T
I
I
O
O
N
N
!
! During the drying process, the thermocouple continuity can become
compromised. Be sure to check again with an ohm-meter.
3) Once the part(s) are dry, finish applying glue in the remaining area in the channel. Repeat
steps 1 and 2.
Figure 32. TTV Final Glue Application