Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix D: TCASE Reference Metrology
R
Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide 73
4) Remove parts and allow them to cool. Remove all tape and check for any unwanted epoxy
dots or lines. Use the Exacto* knife to remove the extraneous epoxy from the surface.
5) Using an ohmmeter, measure the thermocouple electrical resistance to ensure a value of 25 Ω
or less.
6) Trim the excess glue from the IHS surface as shown below.
C
C
A
A
U
U
T
T
I
I
O
O
N
N
!
! Be sure not to
damage the surface of the IHS. Any deep scratches can cause erroneous test results.
Figure 33. Trimming of Excess Glue
7) Thoroughly clean the part before beginning any test procedures.
Figure 34. Final TTV Cleaning