Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix E: TTV Metrology
R
Intel
®
Pentium
®
4 on 90 nm Process Thermal Design Guide 75
Appendix E: TTV Metrology
Thermal Test Vehicle (TTV) Information
Introduction
The Pentium 4 processor on 90 nm process Thermal Test Vehicle (TTV) is a FC-mPGA4 package
assembled with a thermal test die. The TTV is designed for use in platforms targeted for the
Pentium 4 processor on 90 nm process.
Thermal solution performance should be characterized using the TTV. The TTV provides a well-
characterized tool suitable for simulating processor thermal behavior well before actual parts are
available. A resistance-type heater band covers the surface area of the test die and is used to
simulate the heat generation of an actual processor core. The power dissipation is uniform across
the test die and requires correction factors to account for non-uniform heat dissipation in an actual
processor.
The part number for the Pentium 4 processor on 90 nm process TTV is QSV0. Figure 36 shows
the markings on the top of the TTV IHS.
Figure 36. Intel
®
Pentium
®
4 Processor on 90 nm Process Thermal Test Vehicle Topside
Markings
The room temperature resistance of the heater is 23 Ω ± 3 Ω. This resistance value will increase
as the die temperature increases. The heater resistance should always be measured for each TTV
prior to testing. The TTV is not sensitive to static electricity.
TTV Preparation
The IHS surface should be cleaned with alcohol prior to any thermal testing to remove any dirt or
residue. A clean surface will aid in achieving a good thermal interface between the processor and
heatsink. Visually inspect the TTV to ensure that none of the pins are bent or damaged.