Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines

Appendix E: TTV Metrology
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76 Intel
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Pentium
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4 on 90 nm Process Thermal Design Guide
TTV Connections for Power-Up
The TTV heater is connected to external pins and can be powered by an external DC power
supply. The resistance heater of the thermal die is terminated at the power and ground pins of the
package (VCC and VSS). The power and ground pin-out of the TTV match the power and ground
pin-out of the actual processor, allowing use of a standard motherboard for power-up.
Obtain an unpopulated motherboard designed to accept the 478-pin mPGA socket and either the
Pentium 4 processor on 90 nm process or the Pentium 4 processor in the 478-pin package. An
example motherboard is shown in Figure 37. Mount a 478-pin mPGA socket to the board using a
SMT process as shown in Figure 38.
Figure 37. Unpopulated Motherboard
Figure 38. Motherboard with Socket Attached