Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Thermal Specifications

Intel

Pentium

4 Processor Thermal Design Guide 13

3 Thermal Specifications

3.1 Processor Case Temperature and Power

Dissipation

Refer to the Intel

Pentium

4 Processor with 512-KB L2 Cache on 0.13 Micron Process

Datasheet for processor thermal specifications.

Thermal specifications for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process

are given in terms of maximum case temperature specification and thermal design power (TDP).

These values may depend on the processor frequencies and also include manufacturing variations.

Designing to these values allows optimizing thermal design for processor performance (refer to

Section 3.4).

Processor power is dissipated through the IHS. There is no additional component (i.e., BSRAMs,

which generates heat on this package).

The case temperature is defined as the temperature measured at the center of the top surface of the

IHS. For illustration, the measurement location for a 35-mm x 35-mm FC-PGA2 package is shown

in Figure 1. Techniques for measuring the case temperature are detailed in Section 3.3.3.

Figure 1. Processor Case Temperature Measurement Location