Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Thermal Specifications

Intel

Pentium

4 Processor Thermal Design Guide 23

Figure 6. Location of Kapton* Tape for Temporary Bond

7. With the thermocouple temporarily held to the part, apply epoxy to the thermocouple bead for

a permanent bond. If applying Omegabond 101 epoxy, a small piece of paper works well for

mixing. Follow the manufacturer’s instructions for mixing.

8. Use the Exacto* knife or similar to apply the epoxy to the thermocouple bead. Dab glue on

the bead and the exposed wires. Use only the appropriate amount of epoxy to cement the

thermocouple to the IHS. Excess epoxy will prevent the heatsink from mating flush with the

IHS. The entire bead should be submerged and it is best to have insulated wires protruding

from the epoxy. (See following Figure 7).

Figure 7. Thermocouple Bead Covered with Epoxy

9. Add other tack-downs of epoxy along the length of wire to provide strain relief for the

thermocouple wire. Remove any small epoxy dots or lines that have been accidentally added

after the epoxy cures.

10. Follow the epoxy manufacturer’s instructions for curing the epoxy. If an oven is used for

curing the epoxy, ensure the vibration in the oven is minimal to prevent the thermocouple

bead from moving and losing intimate contact with the IHS.

11. Once the epoxy has cured, remove all tape and check for any epoxy residual outside the

thermocouple attach area. Run the tip of your finger around the IHS surface to find any small

epoxy dots. Remove the non-necessary epoxy residual completely so it does not impact

heatsink to IHS mating surface. Clean the IHS surface after conducting this finger test.

12. Check for electrical continuity between the thermocouple and the IHS again. If there is

no electrical continuity between the thermocouple and the IHS, repeat Steps 4–12.