Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Thermal Specifications
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28 Intel
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Pentium
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4 Processor Thermal Design Guide
3.3.4.2 Thermal Test Die
A resistance-type heater covers nearly the entire surface area of the test die and is used to simulate
the heat generation of an actual processor die.
The room temperature resistance of the ITVN1 heater is about 60 Ω, ±5% and the QEL0 heater is
about 51 Ω, ±5%. This resistance value will increase as the die temperature increases.
The heater is connected to external pins so that it can be powered by an external DC power supply.
The resistance heater of the thermal die is terminated at the power and ground pins of the package.
The power and ground pin-out of the TTV must match the power and ground pin-out of the actual
processor. Intel recommends the TTV be used with a bare motherboard designed for the Pentium 4
processor with 512-KB L2 cache on 0.13 micron process (See Figure 12).
Figure 12. Un-populated Mainboard