Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

R
Intel
®
Pentium
®
4 Processor Thermal Design Guide 3
Contents
1 Introduction ..........................................................................................................................7
1.1 Document Goals and Scope...................................................................................7
1.1.1 Importance of Thermal Management......................................................7
1.1.2 Document Goals......................................................................................7
1.1.3 Document Scope.....................................................................................7
1.2 References..............................................................................................................8
1.3 Definition of Terms..................................................................................................9
2 Mechanical Requirements .................................................................................................11
2.1.1 Processor Package ...............................................................................11
2.1.2 Heatsink Attach .....................................................................................12
3 Thermal Specifications ......................................................................................................13
3.1 Processor Case Temperature and Power Dissipation..........................................13
3.2 Designing a Cooling Solution for the Intel
®
Pentium
®
4 Processor with 512-KB L2
Cache on 0.13 Micron Process.............................................................................14
3.2.1 Heatsink Design Considerations ...........................................................14
3.2.1.1 Thermal Interface Material...................................................15
3.2.1.2 Summary..............................................................................15
3.2.2 Looking at the Whole Thermal Solution ................................................16
3.2.2.1 Chassis Thermal Design Capabilities ..................................16
3.2.2.2 Improving Chassis Thermal Performance ...........................16
3.2.2.3 Characterizing Cooling Performance Requirements ...........17
3.2.2.4 Example of Heatsink Performance Evaluation ....................18
3.3 Thermal Metrology for the Intel
®
Pentium
®
4 Processor with 512-KB L2 Cache on
0.13 Micron Process .............................................................................................19
3.3.1 Processor Cooling Solution Performance Assessment ........................19
3.3.2 Local Ambient Temperature Measurement Guidelines.........................19
3.3.3 Processor Case Temperature Measurement Guidelines......................21
3.3.3.1 Thermocouple Attachment...................................................22
3.3.3.2 Heatsink Preparation – Rectangular (Cartesian) Geometry 24
3.3.3.3 Heatsink Preparation – Radial (Cylindrical) Geometry ........25
3.3.3.4 Thermal Measurement.........................................................26
3.3.4 Thermal Test Vehicle Information .........................................................27
3.3.4.1 Introduction ..........................................................................27
3.3.4.2 Thermal Test Die .................................................................28
3.3.4.3 Alternate Method for TTV Connections ...............................30
3.3.4.4 Thermal Measurements.......................................................31
3.3.4.5 TTV Correction Factor to the Intel
®
Pentium
®
4 Processor
with 512-KB L2 Cache on 0.13 Micron Process .................32
3.4 Thermal Management Logic and Thermal Monitor Feature .................................33
3.4.1 Processor Power Dissipation ................................................................33
3.4.2 Thermal Monitor Implementation ..........................................................34
3.4.3 Bi-Directional PROCHOT# ....................................................................35
3.4.4 Operation and Configuration .................................................................35
3.4.5 System Considerations .........................................................................36