Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

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4 Intel
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Pentium
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4 Processor Thermal Design Guide
3.4.6
Operating System and Application Software Considerations................37
3.4.7 Legacy Thermal Management Capabilities ...........................................37
3.4.7.1 Thermal Diode .....................................................................38
3.4.7.2 THERMTRIP# ......................................................................39
3.4.7.3 Thermal Measurement Correlation ......................................39
3.4.8 Cooling System Failure Warning...........................................................39
4 Intel Thermal Mechanical Reference Design Information .................................................41
4.1 Intel Validation Criteria for the Reference Design.................................................42
4.1.1 Acoustics ...............................................................................................42
4.1.2 Altitude...................................................................................................42
4.1.3 Reference Heatsink Thermal Validation................................................42
4.1.4 Fan Performance for Active Heatsink Thermal Solution .......................43
4.1.5 Environmental Reliability Testing ..........................................................43
4.1.5.1 Structural Reliability Testing.................................................43
4.1.5.2 Random Vibration Test Procedure ......................................43
4.1.5.3 Shock Test Procedure .........................................................44
4.1.5.4 Recommended Test Sequence ...........................................45
4.1.5.5 Post-Test Pass Criteria ........................................................45
4.1.6 Long-Term Reliability Testing................................................................45
4.1.6.1 Temperature Cycling............................................................45
4.1.6.2 Recommended BIOS/CPU/Memory Test Procedures.........46
4.1.7 Material and Recycling Requirements...................................................47
4.1.8 Safety Requirements.............................................................................47
4.2 Geometrical Envelope for Intel Reference Thermal Mechanical Design ..............48
4.3 3.06 GHz or Higher Intel Reference Thermal Solution .........................................52
4.3.1 Reference Components Overview ........................................................52
4.3.2 Enabled Reference Components ..........................................................54
4.3.2.1 Retention Mechanism ..........................................................54
4.3.2.2 Heatsink Attach Clip Information .........................................54
4.3.3 Heatsink Mechanical Design Guidelines ...............................................54
4.3.4 Thermal Interface Material ....................................................................55
4.3.5 Enabled Reference Design Test Results ..............................................55
5 Conclusion.........................................................................................................................57
Appendix A: Thermal Interface Management ...........................................................................................59
Appendix B: Mechanical Drawings............................................................................................................61
Appendix C: Intel Enabled Reference Thermal Solution...........................................................................71
Appendix D: Evaluated Third-Party Thermal Solutions.............................................................................73