Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Intel Thermal Mechanical Reference Design Information
R
Intel
®
Pentium
®
4 Processor Thermal Design Guide 41
4 Intel Thermal Mechanical
Reference Design Information
Intel develops thermal and mechanical reference components to demonstrate cooling capabilities
for current and future microprocessors. This section outlines the requirements used in developing
and evaluating these reference designs.
Taking into account the wide heatsink performance range needed to support the entire life of the
Pentium 4 Processor with 512-KB L2 cache on 0.13 micron process, several cooling solutions
may be developed accordingly. Table 3 gives details how this is broken down from the Intel
Reference Design perspective. It includes the reference heatsink performance target for
frequencies at 3.06 GHz or higher.
The table also includes the T
A
assumption at the processor fan heatsink inlet discussed in
Section 3.2.2.1. Combining the target T
A
with the target Ψ
CA
enables to get the optimum
performance from the processor (refer to Chapter 3 and Section 3.4).
Refer to the Intel
®
Pentium
®
4 Processor with 512-KB L2 Cache on 0.13 Micron Process
Datasheet for detailed processor thermal specifications.
Table 3. Reference Heatsink Thermal Performance Targets
Target Frequencies
(Refer to processor
Datasheet)
Thermal Performance
Targets, Ψ
ΨΨ
Ψca
(Mean + 3σ
σσ
σ)
T
A
Assumption Notes
1.40 GHz – 2.80 GHz 0.40 °C/W T
A
= 45 °C 1
3.06 GHz or higher 0.33 °C/W T
A
= 42 °C 1
NOTES:
1. T
C
and TDP are constant, while Ψ
CA
may vary according to T
A
. The T
A
values given in this table reflect
the assumption of Intel for the reference design that there will be thermal performance improvements
for the chassis for processors operating at 3.06 GHz or higher.