Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Intel Thermal Mechanical Reference Design Information

Intel

Pentium

4 Processor Thermal Design Guide 47

4.1.7 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose

materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic

materials such as PVC formulations, certain polyurethane compositions (e.g., polyester and some

polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes

also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-

810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel

recycling standards.

4.1.8 Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the

safety standards:

• UL Recognition-approved for flammability at the system level. All mechanical and thermal

enabling components must be a minimum UL94V-2 approved.

• CSA Certification. All mechanical and thermal enabling components must have CSA

certification.

• Heatsink fins must meet the test requirements of UL1439 for sharp edges.

• If the International Accessibility Probe specified in IEC 950 can access the moving parts of

the fan, consider adding safety feature so that there is no risk of personal injury to one’s

finger.