Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

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Intel
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Pentium
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4 Processor Thermal Design Guide 5
Figures
Figure 1. Processor Case Temperature Measurement Location ......................................13
Figure 2. Processor Thermal characterization parameter Relationships ..........................18
Figure 3. Guideline Locations for Measuring Local Ambient Temperature for an Active
Heatsink (not to scale)................................................................................................20
Figure 4. Guideline Locations for Measuring Local Ambient Temperature for a Passive
Heatsink (not to scale)................................................................................................21
Figure 5. Desired Thermocouple Location ........................................................................22
Figure 6. Location of Kapton* Tape for Temporary Bond..................................................23
Figure 7. Thermocouple Bead Covered with Epoxy ..........................................................23
Figure 8. Grooved Heatsink Bottom ..................................................................................24
Figure 9. Heatsink Bottom Groove Dimensions ................................................................25
Figure 10. Radial Heatsink Geometry ...............................................................................26
Figure 11. Thermal Test Vehicle Markings........................................................................27
Figure 12. Un-populated Mainboard ..................................................................................28
Figure 13. Mainboard Wire Attach Location for TTV Heater Access ................................29
Figure 14. Measured Resistance Between Processor Power and Ground Planes ...........29
Figure 15. TTV Wiring Diagram.........................................................................................31
Figure 16. Thermal Sensor Circuit.....................................................................................34
Figure 17. Concept for Clocks under Thermal Monitor Control.........................................35
Figure 18. Thermal Diode Sensor Time Delay ..................................................................38
Figure 19. Random Vibration PSD ....................................................................................44
Figure 20. Shock Acceleration Curve ................................................................................44
Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components – 1 .........................................................................................................49
Figure 22. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components – 2 .........................................................................................................50
Figure 23. Volumetric Keep-in for Enabling Components .................................................51
Figure 24. Exploded Reference Design Concept Sketch ..................................................53
Figure 25. Retention Mechanism – 1 of 2..........................................................................62
Figure 26. Retention Mechanism – 2 of 2..........................................................................63
Figure 27. Clip ...................................................................................................................64
Figure 28. Fan Attach ........................................................................................................65
Figure 29. Fan Impeller Sketch .........................................................................................66
Figure 30. Heatsink Drawing - 1 of 2 .................................................................................67
Figure 31: Heatsink Drawing – 2 of 2 ................................................................................68
Figure 32. Fan Heatsink Assembly (with non-validated fan guard) – 1 of 2 ......................69
Figure 33. Fan Heatsink Assembly (with non-validated fan guard) – 2 of 2 ......................70
Tables
Table 1. Recommended DC Power Supply Ratings..........................................................30
Table 2. TTV Correction Factors .......................................................................................32
Table 3. Reference Heatsink Thermal Performance Targets ...........................................41
Table 4. Temperature Cycling Parameters .......................................................................45
Table 5. Reference Design Results Summary ..................................................................55
Table 6. Intel Representative Contact for Licensing Information.......................................71
Table 7. Intel Reference Component Thermal Solution Provider(s)..................................71
Table 8. Independently Evaluated Thermal Solutions .......................................................73