Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Intel Thermal Mechanical Reference Design Information

52 Intel

Pentium

4 Processor Thermal Design Guide

4.3 3.06 GHz or Higher Intel Reference Thermal

Solution

As mention in the previous section, Intel develops thermal and mechanical reference components

to demonstrate cooling capabilities for current and future microprocessors. This section details

information on the reference components designed to meet target frequencies at 3.06 GHz or

higher.

The reference components in this section are made available for purchase through the listed

reference design suppliers. Refer to Appendix C: Intel Enabled Reference Thermal Solution for

more information. In addition, the reference component designs are also available for adoption by

suppliers and heatsink integrators pending completion of appropriate licensing contracts. For

more information on licensing, contact your local field sales office.

4.3.1 Reference Components Overview

The reference thermal mechanical solution that supports frequencies at 3.06 GHz or higher,

consists of:

• Heatsink clip

• Fan & Fan Attach

• Heatsink

• Thermal interface material

• Retention mechanism

Refer to Appendix B: Mechanical Drawings for drawings of the individual components.