Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Intel Thermal Mechanical Reference Design Information

54 Intel

Pentium

4 Processor Thermal Design Guide

4.3.2 Enabled Reference Components

4.3.2.1 Retention Mechanism

The retention mechanism for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron

process thermal mechanical reference solution is identical to the Pentium

4 processor in the

478-pin package reference retention mechanism.

4.3.2.2 Heatsink Attach Clip Information

The 3.06 GHz or higher heatsink attach clip has been redesigned for the Pentium 4 processor with

512-KB L2 cache on 0.13 micron process. This new clip features a tool-less design and is

constructed without the levers used on the previous design. The clip is pre-formed to provide the

appropriate level of preload (~51 Lbs) necessary to meet the design requirements. The clip is

designed to retain 380 g. For more information, see Appendix B: Mechanical Drawings.

4.3.3 Heatsink Mechanical Design Guidelines

The reference mechanical components are meant to interface with the Intel reference fan heatsink

that will be developed for frequencies at 3.06 GHz or higher for the Pentium 4 processor with

512-KB L2 cache on 0.13 micron process.

Other custom heatsinks must support the following interface control requirements to be

compatible with the reference mechanical components:

Requirement 1: Heatsink/fan/shroud assembly must stay within the volumetric keep-in.

Requirement 2: Max mass and Center of Gravity

Heatsink assemblies that attach to the reference retention mechanism should not

exceed 450 grams mass (combination of heatsink and fan assembly). This

represents the design limit for the proposed processor retention mechanism and

478-pin socket to withstand mechanical shock and vibration requirements. The

3.06 GHz or higher clip is designed to a mass limit of 380 grams.

The combined center of gravity of the heatsink /fan /shroud assembly must be

no greater than 0.85 inch above the bottom surface of the heatsink base.