Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines

Introduction
R
Intel
®
Pentium
®
4 Processor Thermal Design Guide 7
1 Introduction
1.1 Document Goals and Scope
1.1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within their functional temperature range. Within this temperature range, a
component, and in particular its electrical circuits, is expected to meet its specified performance.
Operation outside the functional temperature range can degrade system performance, cause logic
errors or cause component and/or system damage. Temperatures exceeding the maximum
operating limit of a component may result in irreversible changes in the operating characteristics
of this component.
In a system environment, the processor temperature is a function of both system and component
thermal characteristics. The system level thermal constraints consist of the local ambient air
temperature and airflow over the processor as well as the physical constraints at and above the
processor. The processor temperature depends in particular on the component power dissipation,
the processor package thermal characteristics, and the processor thermal cooling solution.
All of these parameters are aggravated by the continued push of technology to increase processor
performance levels (higher operating speeds, GHz) and packaging density (more transistors). As
operating frequencies increase and packaging size decreases, the power density increases while the
thermal solution space and airflow typically become more constrained or remain the same within
the system. The result is an increased importance on system design to ensure that thermal design
requirements are met for each component, including the processor, in the system.
1.1.2 Document Goals
The thermal power of the Intel
®
Pentium
®
4 processor with 512-KB L2 cache on 0.13 micron
process is higher, as well as denser, than previous Intel architecture processors. Depending on the
type of system and the chassis characteristics, new system designs may be required to provide
adequate cooling for the processor. The goal of this document is to provide an understanding of
these thermal characteristics and discuss guidelines for meeting the thermal requirements imposed
on single processor systems for the entire life of the Pentium 4 processor with 512-KB L2 cache
on 0.13 micron process
1.1.3 Document Scope
Chapters 2 and 3 of this document discusses thermal solution design requirements for the Pentium
4 processor with 512-KB L2 cache on 0.13 micron process. Chapter 3 includes thermal metrology
recommendations to validate a processor cooling solution; it also addresses the benefits of the
processor integrated thermal management logic on thermal design.