Mechanical Enabling for the Intel Pentium 4 Processor in the 478-Pin Package
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Design Effectiveness
Summary
Processor Package Pull-Out
Use preload coupled with stiff clip to prevent pull-out
Socket Solder Joint Protection
Use preload coupled with stiff clip to avoid excessive tensile loads on solder joint
MCH Solder Joint Protection
Use preload coupled with stiff clip to avoid excessive tensile loads on solder joint
Thermal Requirements
Use preload to achieve TIM performance
Chassis-Independent Solution
Allows motherboard design flexibility
Supports horizontal building block approach
Intel Reference Design Meets the Primary Mechanical Challenges