Mechanical Enabling for the Intel Pentium 4 Processor in the 478-Pin Package

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In Summary
 Five primary challenges addressed:
 During shock and vibration events:
 Avoid processor package pull-out
 Protect against socket solder joint damage
 Protect against MCH solder joint damage
 Prevent TIM thermal performance degradation
 Allow chassis-independent solution
 Preload is critical element in addressing each challenge
 Stiff clip is critical in preventing package pull-out and
protecting solder joint
 Intel Reference Design combines both strategies to
meet all critical requirements