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Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

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Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 123
R
9.10. Internal LAN Layout Guidelines
The ICH3-M provides several options for integrated LAN capability. The platform supports several
components depending on the target market. These guidelines use the 82562ET to refer to both the
82562ET and 82562EM. The 82562EM is specified in those cases where there is a difference.
Table 41. Integrated LAN Capability
Platform LAN Connect
component
Connection Features
82562EM Advanced 10/100 Ethernet AOL* & Ethernet 10/100 Connection
82562ET 10/100 Ethernet Ethernet 10/100 Connection
82562EH 1 Mb HomePNA* LAN 1 Mb HomePNA* connection
Intel developed a dual footprint for 82562ET and 82562EH to minimize the required number of board
builds. A single layout with the specified dual footprint will allow the OEM to install the appropriate
Platform LAN Connect component to meet the market need.
Figure 63. ICH3-M/LAN Connect Section (Dual Footprint Option)
82562EH/ 82562ETICH3
Magnetics
Module
Connector
A
B
D
C
Refer to 82562EH/82562ET Section
Dual Footprint
ICH3-M