Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
124 Design Guide
R
Table 42. LAN Design Guide Section Reference
Layout Section Figure 13-22 Reference Design Guide Section
ICH3-M – LAN
Interconnect
A ICH3-M – LAN Interconnect Guidelines
General Routing
Guidelines
B,C,D
82562EH B
82562ET /82562EM C
Dual Layout Footprint D
9.10.1. ICH3-M – LAN Interconnect Guidelines
This section contains guidelines to the design of motherboards and riser cards to comply with LAN
Connect. It should not be treated as a specification and the system designer must ensure through
simulations or other techniques that the system meets the specified timings. Special care must be given to
matching the LAN_CLK traces to those of the other signals, as shown below. The following are
guidelines for the ICH3-M to LAN component interface. The following signal lines are used on this
interface:
• LAN_CLK
• LAN_RSTSYNC
• LAN_RXD[2:0]
• LAN_TXD[2:0]
This interface supports both 82562EH and 82562ET/82562EM components. Signal lines LAN_CLK,
LAN_RSTSYNC, LAN_RXD[0], and LAN_TXD[0] are shared by both components. Signal lines
LAN_RXD[2:1] and LAN_TXD[2:1] are not connected when 82562EH is installed. Dual footprint
guidelines are found in Figure 63.
Bus Topologies
The LAN Connect Interface can be configured in several topologies:
• Direct point-to-point connection between the ICH3-M and the LAN component
• Dual Footprint
• LOM/CNR Implementation
9.10.1.1. Point-to-point Interconnect
The following are guidelines for a single solution motherboard. Either 82562EH, 82562ET, or CNR is
installed.