Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
140 Design Guide
R
The dual footprint for this particular solution uses a SSOP footprint for 82562ET and a TQFP footprint
for 82562EH. The combined footprint for this configuration is shown in the below two figures.
Figure 73. Dual Footprint LAN Connect Interface
L
L
ICH3
82562EH
TQFP
8
2
5
6
2
E
T
S
S
O
P
LAN_CLK
LAN_RSTSYNC
LAN_RXD[2:0]
LAN_TXD[2:0]
S
S
t
t
u
u
b
b
Figure 74. Dual Footprint Analog Interface
82562EH/82562ET
Magnetics
Module
RJ11
RJ45
TDP
TDN
RDP
RDN
TXP
TXN
Ring
Tip
82562EH
Config.
82562ET
Config.
The following are additional guidelines for this configuration:
• L = 0.5 inches to 6.5 inches
• Stub < 0.5 inches
• Either 82562EH or 82562ET/82562EM can be installed. Not both
• 82562ET pins 28, 29, and 30 overlap with 82562EH pins 17, 18, and 19.
• Overlapping pins are tied to ground.
• No other signal pads should overlap or touch.
• The 82562EH and 82562ET configurations share signal lines LAN_CLK, LAN_RSTSYNC,
LAN_RXD[0], LAN_TXD[0], RDP, RDN, RXP/Ring, and RXN/Tip.
ICH3-M