Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel

Pentium

4 Processor-M and Intel

845MP/845MZ Chipset Platform

Design Guide 141

• No stubs should be present when 82562ET is installed.

• Packages used for the Dual Footprint are TQFP for 82562EH and SSOP for 82562ET.

• A 22-Ω resistor can be placed at the driving side of the signal line to improve signal quality on the

LAN connect interface.

• Resistor should be placed as close as possible to the component.

• Use components that can satisfy both the 82562ET and 82562EH configurations (i.e. magnetic

module).

• Install components for either the 82562ET or the 82562EH configuration. Only one configuration

can be installed at a time.

• Route shared signal lines such that stubs are not present or are kept to a minimum.

• Stubs may occur on shared signal lines (i.e. RDP and RDN). These stubs are due to traces routed to

an uninstalled component. In an optimal layout, there should be no stubs.

• Use 0-Ω resistors to connect and disconnect circuitry not shared by both configurations. Place

resistor pads along the signal line to reduce stub lengths.

• Traces from magnetic to connector must be shared and not stubbed. An RJ-11 connector that fits

into the RJ-45 slot is available. Any amount of stubbing will destroy both HomePNA* and Ethernet

performance.