Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 167
R
Two 0.1 µF, 0603, X7R capacitors and one 4.7 µF, X5R capacitors should be placed between the
VCCPAUX supply pins and the VSS ground pins. Place the all capacitors as close to the ICH3-M
package as possible, but ensure the 0603 capacitors are the closest to the package. Connections should
be done to minimize loop area and loop inductance of these capacitors.
11.5.3.2. 3.3-V Power Supply Rails
Twelve 0.1 µF, 0603, X7R capacitors and one 22.0 µF, X5R capacitors should be placed between the
VCCPPCI supply pins and the VSS ground pins. Place the all capacitors as close to the ICH3-M
package as possible, but ensure the 0603 capacitors are the closest to the package. Connections should be
done to minimize loop area and loop inductance of these capacitors.
Three 0.1
µF, 0603, X7R capacitors and one 10.0 µF, X5R capacitors should be placed between the
VCCSUS supply pins and the VSS ground pins. Place the all capacitors as close to the ICH3-M package
as possible, but ensure the 0603 capacitors are the closest to the package. Connections should be done to
minimize loop area and loop inductance of these capacitors.
Two 0.1
µF, 0603, X7R capacitors and one 22 µF, X5R capacitors should be placed between the
VCCAUX supply pins and the VSS ground pins. Place the all capacitors as close to the ICH3-M
package as possible, but ensure the 0603 capacitors are the closest to the package. Connections should
be done to minimize loop area and loop inductance of these capacitors.
11.5.4. MCH-M Decoupling Recommendations
11.5.4.1. VCC_CORE, VTT Processor System Bus, VTT
Ten 0.1 µF, 0603, X7R capacitors and three 10.0 µF, 1206, X5R capacitors should be placed between
the VTTFSB supply pins and the VSS ground pins. Place the all capacitors as close to the MCH-M
package as possible, but ensure the 0603 capacitors are the closest to the package. Connections should
be done to minimize loop area and loop inductance of these capacitors.
11.5.4.2. 1.5-V AGP/CORE
Six 0.1 µF, 0603, X7R capacitors and two 10.0 µF, 1206, X5R capacitors should be placed between the
VCCAGP/VCCCORE supply pins and the VSS ground pins. Place the all capacitors as close to the
MCH-M package as possible, but ensure the 0603 capacitors are the closest to the package. Connections
should be done to minimize loop area and loop inductance of these capacitors.
11.5.4.3. 1.8-V Hub Interface
Three 0.1 µF, 0603, X7R capacitors and one 10.0 µF, 1206, X5R capacitors should be placed between
the VCCHL supply pins and the VSS ground pins. Place the all capacitors as close to the MCH-M
package as possible, but ensure the 0603 capacitors are the closest to the package. Connections should
be done to minimize loop area and loop inductance of these capacitors.
11.5.5. 2.5-V MCH-M System Memory High Frequency Decoupling
Every MCH-M ground and power ball in the system memory interface should have its own via. For 2.5-
V high frequency decoupling, a minimum of six 0603 0.1-
µF high frequency capacitors is required, and
must be within 150 mils of the MCH-M package. The six capacitors should be evenly distributed along