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Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

ManualsBrandsIntel ManualsOtherIntel Pentium 4 Processor supporting HT Technology 3.00E GHz, 1M Cache, 800 MHz FSB
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Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 181
R
The ground flood should be viaed through to the ground plane with no less than 12-16 vias under the
part. It should be well connected. For all power connections, heavy duty and/or dual vias should be used.
It is imperative that the standard signal vias and small traces not be used for connecting decoupling caps
and ground floods to the power and ground planes. VddA should be generated by using a CLC filter.
This VddA should be connected to the Vdd side of the three capacitors that require it using a hefty trace
on the top layer. This trace should be routed from the CLC filter using a star topology.