Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
186 Design Guide
R
12.3. Thermal Sensor
Table 70. Thermal Sensor Signals
Mobile Intel Pentium 4 Processor-M – Thermal Sensor
Signal System Pull-up/Pull-
down
Ω
ΩΩ
Ω Notes
9
ADD[1:0] Pull-up to V3.3S 1 kΩ
STBY# Pull-up to V3.3S 10 kΩ
SMBDATA Pull-up to V3.3S 10 kΩ
SMBCLK Pull-up to V3.3S 10 kΩ
THRM_ALERT# Pull-up to V3.3S 10 kΩ To enable alert, ALERT# can be connected to
THRM# on ICH-M
DXP, DXN Route both signals on same layer
12.4. PLL[2:1] PLC Filter
Table 71. PLL[2:1] RLC Filter
Mobile Intel Pentium 4 Processor-M – PLL[2:1] RLC Filter
Device Value Notes 9
99
9
L 4.7 µH at 80 mA or 10 µH at 60 mA Rated for DC current > 60 mA
C 22-100 µF ESR<0.3 Ω
ESL<5 nH
Tolerance ± 20%
12.5. Decoupling Recommendation
Table 72. Decoupling Recommendation
Mobile Intel Pentium 4 Processor-M – High Frequency Decoupling Recommendations*
Signal Configuration F Qty Notes 9
99
9
+VCC_CORE See Processor
Power Delivery
Design
Recommendations
10 µF_6.3
V
38 Use 2-3 vias per pad
for reduced
inductance during
layout. Placement
should be near
processor for all
NOTE: *All decoupling guidelines are recommendations based on our reference board design. Customers will need
to take their layout and PCB board design into consideration when deciding on their overall decoupling
solution.