Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 197
R
Table 82. Decoupling Recommendation
AGP– High Speed Decoupling Recommendations*
Signal Configuration F Qty Notes 9
99
9
AGP_VREF Decouple to GND 0.1 µF 2 Place one capacitor near MCH-M
and one near AGP connector
+V1-5S_AGP Decouple to GND 150 µF
0.1 µF
22 µF
2
7
1
Distribute as close as possible to
AGP connector VDDQ and
VDDQ1.5 Quadrants
+V3S_AGP Decouple to GND 100 µF
0.1 µF
22 µF
1
3
2
Distribute as close as possible to
AGP connector VCC3.3 Quadrant
+V5S_AGP Decouple to GND 0.1 µF
22 µF
2
1
Distribute as close as possible to
AGP connector V5.0 Pins
+V12S Decouple to GND 0.1 µF 1 Distribute as close as possible to
AGP connector 12 V Pin
Table 83. Reference Voltage Dividers
AGP– Reference Voltage Dividers*
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Notes 9
99
9
AGP_VREF 1 kΩ (Each
resistor in
divider)
Place in between video controller and
MCH-M. (1/2)VDDQ to video controller
and MCH-M.
NOTE: All decoupling guidelines are recommendations based on our reference board design. Customers will need
to take their layout and PCB board design into consideration when deciding on their overall decoupling
solution.