Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 201
R
Table 88. LPC Interface
ICH3-M – LPC Interface
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Notes 9
99
9
LPC_AD[3:0], LPC_DRQ#[1:0] Has integrated weak internal pull-up
Table 89. USB Interface
ICH3-M – USB Interface
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Series
Damping
Notes 9
99
9
USB_RBIAS Pull-down to GND 18.2 Ω ±
1%
22.6
Ω for ICH3-M B0 ES Samples
only
HUB_VREF
12.12. HUB Interface
Table 90. Decoupling Recommendation
ICH3-M – Hublink Decoupling Recommendations*
Signal Configuration F Qty Notes 9
99
9
HUB_VREF Pull-down to GND 0.01 µF 1 ea.
HUB_VSWING Pull-down to GND 0.1 µF 1 ea.
Table 91. Reference Recommendation
ICH3-M – Hublink Reference Voltage Dividers*
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Notes 9
99
9
HUB_VSWING Voltage divider w/
bottom resistor parallel
to RC in series (0.1
µF)
301
Ω ±1%
(for both)
Place divider pair in middle of bus;
Range for voltage divider resistors: 100
Ω –
1 k
Ω
NOTE: *All decoupling guidelines are recommendations based on our reference board design. Customers will need
to take their layout and PCB board design into consideration when deciding on their overall decoupling
solution.