Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 203
R
Table 94. Decoupling Recommendation
ICH3-M – High Speed Decoupling Recommendations
Signal Configuration F Qty Notes 9
99
9
+VCC_CORE Pull-down to GND 0.1 µF
1.0 µF, 16
V
2
1
Place close to ICH3-M VCCPCPU
pins as possible.
+V1.8S Pull-down to GND 0.1 µF
22 µF
100 µF
7
1
1
Place as close as possible to the
ICH3-M VCCPHL and VCCCORE
Quadrants
+V1.8Always Pull-down to GND 0.1 µF
10
µF
3
1
Place as close as possible to the
ICH3-M VCCSUS Quadrant and one
between balls C23 and B23
+V1.8 Pull-down to GND 0.1 µF
22 µF
2
1
Place as close as possible to the
ICH3-M VCCAUX Quadrant
+V3.3S Pull-down to GND
Pull-down to GND
0.1 µF
22 µF
12
2
Place as close as possible to the
ICH3-M VCCPPCI Quadrant
+V3.3Always Pull-down to GND 0.1 µF
22 µF
8
1
Place as close as possible to the
ICH3-M VCCPUSB and VCCPSUS
Quadrants
+V3.3 Pull-down to GND 0.1 µF
4.7 µF
22 µF
2
1
1
Place as close as possible to the
ICH3-M VCCPAUX Quadrant
Table 95. Reference Voltage Dividers
ICH3-M – Reference Voltage Dividers*
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Notes 9
99
9
+V5S_ICHREF Pull-up to V5S Note
NOTE: *All decoupling guidelines are recommendations based on our reference board design. Customers will need
to take their layout and PCB board design into consideration when deciding on their overall decoupling
solution.
Table 96. ICH3-M Miscellaneous Signals
ICH3-M – Reference Voltage Dividers*
Signal System
Pull-up/Pull-down
Ω
ΩΩ
Ω Notes 9
99
9
SPKR Has integrated pull-down; Integrated pull-down
is only enabled at boot/reset for strapping
functions, otherwise disabled