Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide
Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
Design Guide 39
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normally occupied by the Mobile Pentium 4 Processor-M heat sink. If this is the case, the logic analyzer
vendor will provide a cooling solution as part of the LAI.
3.5.1.1.2. Electrical Considerations
The LAI will also affect the electrical performance of the system bus; therefore, it is critical to obtain
electrical load models from each of the logic analyzers to be able to run system level simulations to prove
that their tool will work in the system. Contact the logic analyzer vendor for electrical specifications and
load models for the LAI solution they provide.