Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
58 Design Guide
R
Figure 21. DQ/CB to DQS Trace Length Matching Requirements
SO-DIMM0
MCH-M Package
MCH-M
DIE
= MCH-M Package Lengths from die Pad to Ball
= Motherboard Trace Lengths
Note: Lengths are measured from MCH-M die pad to SO-
DIMM0 connector
DQ/CB[0
]
DQ/CB[1
]
DQ/CB[2
]
DQ/CB[3
]
DQS
DQ/CB[4
]
DQ/CB[5
]
DQ/CB[6
]
DQ/CB[7
]
DQ/CB Length (Y) = (X ±25 mils)
DQ/CB Length (Y) = (X ±25 mils)
DQS Length = X
SO-DIMM0 SO-DIMM1
MCH-M Package
MCH-M
DIE
= MCH-M Package Lengths from die Pad to
Ball
= Motherboard Trace Lengths
DQ/CB[0
]
DQ/CB[1
]
DQ/CB[2
]
DQ/CB[3
]
DQS
DQ/CB[4
]
DQ/CB[5
]
DQ/CB[6
]
DQ/CB[7
]
DQ/CB Length (Y) = (X ±25 mils)
DQ/CB Length (Y) = (X ±25 mils)
DQS Length = X
Note: Lengths are measured from MCH-M die pad to SO-
DIMM1 connector