Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide
Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
6 Design Guide
R
9.7.1. FWH Decoupling........................................................................................115
9.7.2. In Circuit FWH Programming.....................................................................115
9.8. FWH Signaling Voltage Compatibility ..........................................................................116
9.8.1. FWH Vpp Design Guidelines .....................................................................116
9.9. RTC..............................................................................................................................116
9.9.1. RTC Crystal ...............................................................................................117
9.9.2. External Capacitors ...................................................................................119
9.9.3. RTC Layout Considerations.......................................................................120
9.9.4. RTC External Battery Connection..............................................................120
9.9.5. RTC Routing Guidelines ............................................................................121
9.9.6. VBIAS DC Voltage and Noise Measurements...........................................121
9.9.7. SUSCLK.....................................................................................................122
9.9.8. RTC-Well Input Strap Requirements.........................................................122
9.10. Internal LAN Layout Guidelines ...................................................................................123
9.10.1. ICH3-M – LAN Interconnect Guidelines.....................................................124
9.10.1.1. Point-to-point Interconnect ............................................................124
9.10.1.2. Signal Routing and Layout ............................................................125
9.10.1.3. Crosstalk Consideration................................................................126
9.10.1.4. Impedances...................................................................................126
9.10.1.5. Line Termination ...........................................................................126
9.10.2. General LAN Routing Guidelines and Considerations...............................126
9.10.2.1. General Trace Routing Considerations.........................................126
9.10.2.1.1. Trace Geometry and Length .......................................128
9.10.2.1.2. Signal Isolation............................................................129
9.10.2.2. Power and Ground Connections ...................................................129
9.10.2.2.1. General Power and Ground Plane Considerations .....129
9.10.2.3. A Four-Layer Board Design (Example).........................................130
9.10.2.3.1. Top Layer Routing.......................................................130
9.10.2.3.2. Ground Plane..............................................................131
9.10.2.3.3. Power Plane................................................................131
9.10.2.3.4. Bottom Layer Routing .................................................131
9.10.2.4. Common Physical Layout Issues ..................................................131
9.10.3. 82562EH Home/PNA* Guidelines .............................................................132
9.10.3.1. Related Docs.................................................................................132
9.10.3.2. Power and Ground Connections ...................................................133
9.10.3.3. Guidelines for 82562EH Component Placement ..........................133
9.10.3.4. Crystals and Oscillators ................................................................133
9.10.3.5. Phoneline HPNA Termination .......................................................133
9.10.3.6. Critical Dimensions .......................................................................134
9.10.3.6.1. Distance from Magnetic Module to Line RJ11 ............135
9.10.3.6.2. Distance from 82562EH to Magnetic Module .............135
9.10.3.6.3. Distance from LPF to Phone RJ11 .............................136
9.10.4. 82562ET / 82562EM Guidelines ................................................................136
9.10.4.1. Related Docs.................................................................................136
9.10.4.2. Guidelines for 82562ET / 82562EM Component Placement ........136
9.10.4.3. Crystals and Oscillators ................................................................136
9.10.4.4. 82562ET/82562EM Termination Resistors ...................................137
9.10.4.5. Critical Dimensions .......................................................................137
9.10.4.5.1. Distance from Magnetic Module to RJ45 ....................138
9.10.4.5.2. Distance from 82562ET to Magnetic Module..............138
9.10.4.6. Reducing Circuit Inductance .........................................................138
9.10.4.6.1. Terminating Unused Connections...............................139
9.10.4.6.2. Termination Plane Capacitance..................................139
9.10.5. 82562ET/82562EH Dual Footprint Guidelines...........................................139