Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
60 Design Guide
R
Figure 22. SDQS to SCK/SCK# Trace Length Matching Requirements
DIMM0
MCH Package
MCH
DIE
= MCH Package Lengths from Pad to Ball
= Motherboard Trace Lengths
Note: Lengths are measured from MCH pad to DIMM0 connector
pins.
DQ/CB[0]
DQ/CB[1]
DQ/CB[2]
DQ/CB[3]
DQS
DQ/CB[4]
DQ/CB[5]
DQ/CB[6]
DQ/CB[7]
DQ/CB Length (Y) = (X ±25 mils)
DQ/CB Length (Y) = (X ±25 mils)
DQS Length = X
DIMM0 DIMM1
MCH Package
MCH
DIE
= MCH Package Lengths from Pad to Ball
= Motherboard Trace Lengths
DQ/CB[0]
DQ/CB[1]
DQ/CB[2]
DQ/CB[3]
DQS
DQ/CB[4]
DQ/CB[5]
DQ/CB[6]
DQ/CB[7]
DQ/CB Length (Y) = (X ±25 mils)
DQ/CB Length (Y) = (X ±25 mils)
DQS Length = X
Note: Lengths are measured from MCH pad to DIMM1 connector
pins.
SO-DIMM0
MCH-M Package Lengths from Pad to Ball
MCH-M Package Lengths from Pad to Ball
MCH-M Package
SO-DIMM0
SO-DIMM1
MCH-M Package
Note: Lengths are measured from MCH-M pad to SO-DIMM0 connector
pins.
Note: Lengths are measured from MCH-M pad to SO-DIMM0 connector
pins.
MCH-M DIE
MCH-M DIE