Mobile Intel Pentium 4 Processor - M and Intel 845MP/MZ Chipset Platform Design Guide

Mobile Intel
®
Pentium
®
4 Processor-M and Intel
®
845MP/845MZ Chipset Platform
80 Design Guide
R
Figure 38. SCK to SCK# Trace Length Matching Requirements
SO-DIMM0
MCH-M Package
MCH-M
DIE
= MCH Package Lengths from Die
Pad to Ball
= Motherboard Trace Lengths
Note: Lengths are measured from MCH-M
pad to SO-DIMM0 connector pins.
SCK0
SCK#0
SCK1
SCK#1
SCK2
SCK#2
SCK0 Length = X
SCK#0 Length = X
SCK1 Len
g
th =
X
SCK#1 Length = X
SCK2 Length = X
SCK#2 Length = X
SCK3 Length = Y
SCK#3 Length = Y
SCK4 Length = Y
SCK#4 Len
g
th = Y
SCK5 Length = Y
SO-DIMM0
SO-DIMM1
MCH-M Package
MCH-M
DIE
= MCH Package Lengths from
Die Pad to Ball
= Motherboard Trace Lengths
SCK3
SCK3#
SCK4
SCK4#
SCK5
SCK#5
Note: Lengths are measured from MCH-M Die
Pad to SO-DIMM1 connector pins.
SCK#5 Length = Y