Voltage Regulator-Down (VRD) 10.1 Design Guide

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Motherboard Power Plane Layout

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60 Design Guide

Figure 10-1. Reference Board Layer Stack-up

Table 10-1. Reference Board Layer Thickness

Layer Minimum Typical Maximum

L1 Soldermask 0.15 mils 0.65 mils 1.16 mils

L1 1.08 mils 1.90 mils 2.72 mils

L1-2 FR4 3.90 mils 4.40 mils 4.80 mils

L2 1.00 mils 1.20 mils 1.40 mils

Core 57 mils 62 mils 70 mils

L3 1.00 mils 1.20 mils 1.40 mils

L3-4 FR4 3.90 mils 4.40 mils 4.80 mils

L4 1.08 mils 1.90 mils 2.72 mils

L4 Soldermask 0.15 mils 0.65 mils 1.16 mils

NOTE: Consult Figure 10-1 for layer definition

L1 Soldermask

Layer L1: Plated ½ oz. Coppe

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L1-2 FR4

Layer L2: Unplated 1 oz. Coppe

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CORE

Layer L3: Unplated 1 oz. Coppe

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Layer L2: Unplated 1 oz. Coppe

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L3-4 FR4

Layer L4: Plated ½ oz. Coppe

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L4 Soldermask