Datasheet

Intel ®PRO/1000 GT Quad Port Server Adapter Product Weight (grams): 128 grams
D30274, PWLA8494GT, PWLA8494GTBLK, PWLA8494GTG1P20 Manufacturer: Intel Corporation
*= any combination of alpha-numeric characters Issue Date: 2/7/2007
Pb Free Product: SLI
Restriction on Hazardous Substances (RoHS) Compliance
RoHS Definition
*
*
Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
RoHS Declaration Select the appropriate RoHS Declaration(s) from below.
The part does not contain RoHS restricted substances per the definition above.
Other:
LEVEL A MATERIALS AND SUBSTANCES
Asbestos Mercury/Mercury Compounds Polychlorinated Naphthalenes
Azo colorants Ozone Depleting Substances Radioactive Substances
Cadmium /Cadmium Compounds Polybrominated Biphenyls (PBBs) Shortchain Chlorinated Paraffins
Hexavalent Chromium Polybrominated Diphenylethers (PBDEs) Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Hexavalent Chromium Compounds Polychlorinated Biphenyls (PCBs) Tributyl Tin Oxide (TBTO)
This product contains lead/lead compounds.
LEVEL B MATERIALS AND SUBSTANCES
Antimony/Antimony Compounds Bismuth/Bismuth Compounds
Arsenic/Arsenic Compounds Brominated Flame Retardants
Beryllium/Beryllium Compounds Nickel/Nickel Compounds
COMMENTS
1 The data on Level A and B materials and substances are based on analytical testing of the following product: PWLA8494GT
2
This data sheet is based on the product specified and other products within the family are similar.
3 Data in parts per million (ppm) can be used to estimate content for other products within this family.
4 Material mass can be estimated by multiplying concentration (ppm) by product weight.
5 The remainder of this package consists of non-reportable metals (e.g., tin, iron, etc.), epoxy resin and other non-metal materials.
Location in Product
Intel understands RoHS requires: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the
EU or (2) an approved/pending exemption applies. (Note: RoHS implementing details are not fully defined and may change.)
Where the part is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we currently understand the requirements.
Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and
correct.
This part contains RoHS restricted materials (lead) above the threshold level. Exemption status cannot be determined since this part may be used in
exempt and/or non-exempt applications.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in high melting temperature type solders (i.e. tin-
lead sloder alloys containing more than 85% lead).
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in electronic ceramic parts
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in glass of electronic components.
Material Declaration Data Sheet
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in optical and filter glass.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in solders for servers, storage and storage array
systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm,
those materials/substances are listed below.
resistors, capacitors,
magnetics
1020
Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed in the table below are not contained in this product in
quantities above the threshold level for these materials as stated in the EIA/EICTA/JGPSSI Material Composition Declaration Guide, nor intentionally added to
this product.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in solders to complete a viable electrical
connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
Quantity limit of 0.1% by mass (1000 PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl
Ethers (PBDE)
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO THIS MDDS. INTEL SHALL
NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A
RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.
Material Concentration (ppm)
Lead/Lead Compounds
Description of Use
glass in electronic components, ceramic,
first level interconnects
component packaging,
Printed wiring boards
31400
Material / Substance
Description of Use
Material Concentration (ppm)
Brominated Flame
Retardant
Flame Retardant, TBBPA
Individual unit test results may vary due to differences in production and /or sensitivities of analytical testing methods. Data shown on this MDDS reflect part-level
testing intended to validate Intel's RoHS compliance systems. Intel's certification of RoHS compliance at the homogenous material level is based on Supplier
Declarations of Conformance.
Location in Product
Nickel
Plating Bracket 11900
Page 1 of 2