Technical product specification

Design and Environmental Specifications Intel
®
Server Board S2600CP and Server System P4000CP TPS
Revision 1.8
Intel order number G26942-005
172
1. For A3/A4 individual PS selection:
i. For dual power supply configuration, power budget must fit within single power
supply rated load and be installed in dual configuration, or
ii. For single power supply configuration, power budget must be sized with 30%
margin to single power supply rated load.
2. Open Circle: PCI Cards - PCI Adapter card specifications typically include environmental
requirements that will specify required operating ambient and minimum airflow. These PCI
slots are limited to cards that require 100LFM or less.
3. Processor - 130W-4C and 135W-8C may have some performance impact.
4. Processors - There may be some performance impact during fan failures or ambient
excursions.
5. GPGPU cards may have performance impact during ambient excursions.
6. LV refers to low voltage DIMMs (1.35V).
7. When identifying memory in the table, only Rank and Width are required. Capacity is not
required.
8. Cache offload Module can only be installed with 95W processor and DRx8 or equivalent
memory.
15.4 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 40°C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
 Calculation Model: Telcordia* Issue 2, method I case 3
 Operating Temperature: Server in 40°C ambient air
 Operating Environment: Ground Benign, Controlled
 Duty Cycle: 100%
 Quality Level: II
Table 144. MTBF Estimate
Assembly
Failure Rate
MTBF
Motherboard
4,617.71
216,557
Integrated Circuits
1,756.55
569,298
Transistor_Bipolar
6.04
165,508,840
Transistor_MOSFET
418.11
2,391,663
Diodes
20.26
49,353,370
Diodes_LED
90.09
11,099,561
Resistors
960.02
1,041,635
Capacitors
213.71
4,679,143
E-Cap
571.98
1,748,312