Technical product specification

Appendix D: Platform Specific BMC Appendix Intel
®
Server Board S2600CP and Server System P4000CP TPS
Revision 1.8
Intel order number G26942-005
198
Chassis
Fan Domain
Major Components Cooled
(Temperature sensor number)
Fans
(Sensor number)
 Memory channels A and B (B0h)
 Memory channels C and D (B1h)
 Memory channels E and F (B2h)
 Memory channels G and H (B3h)
 BB P2 VR Temp (24h)
 Memory VR (25h)
 Hot-swap backplane 1 (29h)
 Hot-swap backplane 2 (2Ah)
P4208XXM/
P4308XXM/
P4216XXM
(Redundant
fans,
redundant
PSUs)
0
 BMC Temp (23h)
 Memory VR (25h)
 Baseboard NIC (2Fh)
 Server South Bridge (22h)
 Hot-swap backplane 1 (29h)
 Hot-swap backplane 2 (2Ah)
System Fan 1 (30h)
1
 P1 Therm Margin (74h)
 P2 Therm Margin (75h)
 Memory channels C and D (B1h)
 Memory channels E and F (B2h)
 BMC Temp (23h)
 Memory VR (25h)
 Baseboard NIC (2Fh)
 Server South Bridge (22h)
 Hot-swap backplane 1 (29h)
 Hot-swap backplane 2 (2Ah)
System Fan 2 (31h)
2
 P1 Therm Margin (74h)
 P2 Therm Margin (75h)
 Memory channels A and B (B0h)
 Memory channels C and D (B1h)
 Memory channels E and F (B2h)
 Memory channels G and H (B3h)
 BB P2 VR Temp (24h)
 Memory VR (25h)
 Hot-swap backplane 1 (29h)
 Hot-swap backplane 2 (2Ah)
System Fan 3 (32h)
3
 P1 Therm Margin (74h)
 P2 Therm Margin (75h)
 Memory channels A and B (B0h)
 Memory channels C and D (B1h)
 Memory channels E and F (B2h)
 Memory channels G and H (B3h)
 BB P2 VR Temp (24h)
 Memory VR (25h)
 Hot-swap backplane 1 (29h)
 Hot-swap backplane 2 (2Ah)
System Fan 4 (33h)
4
 P2 Therm Margin (75h)
 Memory channels A and B (B0h)
System Fan 5 (34h)