Technical Product Specification
Intel® Server System SC5650HCBRP TPS Introduction
Revision 1.2
Intel order number E81443-002
1
1. Introduction
This Technical Product Specification (TPS) provides board-specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Server System SC5650HCBRP.
In addition, you can obtain design-level information for a given subsystem by ordering the
External Product Specifications (EPS) for the specific subsystem. EPS documents are not
publicly available and you must order them through your local Intel representative.
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Overview
Chapter 3 – Functional Architecture
Chapter 4 – Power Sub-system
Chapter 5 – 6-HDD Expander SAS Hot Swap Backplane
Chapter 6 – Platform Management
Chapter 7 – BIOS Setup Utility
Chapter 8 – Connector / Header Locations and Pin-outs
Chapter 9 – Jumper Blocks
Chapter 10 – Intel
®
Light Guided Diagnostics
Chapter 11 – Design and Environmental Specifications
Chapter 12 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – Processor Active Heat Sink Installation
Appendix C – BMC Sensor Tables
Appendix D – Platform Specific BMC Appendix
Appendix E – POST Code Diagnostic LED Decoder
Appendix F – POST Error Messages and Handling
Appendix G – Installation Guidelines
Glossary
Reference Documents
1.2 Server System Use Disclaimer
Intel
®
Server Systems contain a number of high-density VLSI (Very-large-scale integration) and
power delivery components that require adequate airflow for cooling. Intel ensures through its
own chassis development and testing that when Intel
®
server building blocks are used together,
the fully integrated system meets the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation