Technical Product Specification

Intel® Server System SC5650HCBRP TPS Design and Environmental Specifications
Revision 1.2
Intel order number E81443-002
175
11.3 Processor Power Support
The server boards support the Thermal Design Power (TDP) guideline for Intel
®
Xeon
®
processors. The Flexible Motherboard Guidelines (FMB) were also followed to determine the
suggested thermal and current design values for anticipating future processor needs. The
following table provides maximum values for I
cc
, TDP power and T
CASE
for the compatible Intel
®
Xeon
®
Processor 5500 series.
Table 121. Intel
®
Xeon
®
Processor Dual Processor TDP Guidelines
TDP Power
Max Tcase
Icc Max
Thermal Profile A Thermal Profile B
95 W 75 ℃ 81 ℃ 120 A